Temperature compensation circuit for MicroFC silicon photomultipliers (SiPMs).

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ReferencesQtyDescriptionManufacturerMPNLCSC
C1,C3,C43C0805SAMSUNG(三星)CL21A475KBQNNNEC98192
C21C0603SAMSUNG(三星)CL10B104KC8NNNCC15725
Q1,Q22SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BRonsemi(安森美)MMBT5088LT1GC232555
R11R0603Viking(光颉)AR03BTCX2402C319717
R21R0603VISHAY(威世)NTCS0603E3103FLTC142556
R3,R42R0603YAGEO(国巨)RT0603BRD0749K9LC705780
U11SOT-23-5_L3.0-W1.7-P0.95-LS2.8-BLTI(德州仪器)TPS7B6950DBVRC174327

MicroFC SiPM Temperature Compensation

PCB to temperature compensate the gain of a C-Series MicroFC silicon photomultiplier by onsemi. Diesnged as a passthrough for the SiPM bias voltage. You can buy all the parts and the PCB using Kitspace (non-affiliated).

PCB size is 20 x 40 mm, which is a lot larger than it needs to be, but it's nicer to use with cables this way and solder everything in place.

Front Side PCB Back Side PCB

Front Side PCB Rendering Back Side PCB Rendering

The temperature compensation circuitry is based on a paper by Evgeny Kuznetsov (Temperature-compensated silicon photomultiplier) and aims to roughly support the 21 mv/K slope of the SiPM. Research and testing was at first mostly done by @sebyon, thanks a lot!

However, upon re-testing on a heated 3D printer bed in ranges of 20°C - 50°C it looks more like ~14 mV/K. This might very well be caused by the testing setup. The print bed does not deliver exact temperature values and my multimeter might be off a little bit too. The possibility that different loads affect the slope of the compensation must also be researched in the future. In this testing, there was not load attached except for the multimeter. The whole setup was allowed a 20 minute stablizing period before measuring between each temperature step.

Results Plot

The board features standard SMA edge connectors, which can be used with standard SMA cables to connect between the power supply and the SiPM. Alternatively, you can also solder your own wires to the corresponding pads.